TLV9062IPWR datasheet(10/97 Pages) TI2

10 / 97 page

5.4 Thermal Information: TLV9061

THERMAL METRIC(1)

TLV9061

UNIT

DBV (SOT-23)

DCK (SC70)

DPW (X2SON)

5 PINS

RθJA

Junction-to-ambient thermal resistance

221.7

263.3

467

°C/W

RθJC(top)

Junction-to-case (top) thermal resistance

144.7

75.5

211.6

°C/W

RθJB

Junction-to-board thermal resistance

49.7

332.2

°C/W

ψJT

Junction-to-top characterization parameter

26.1

29.3

°C/W

ψJB

Junction-to-board characterization parameter

50.3

330.6

°C/W

RθJC(bot)

Junction-to-case (bottom) thermal resistance

N/A

125

°C/W

(1)

For more information about traditional and new thermal metrics, see Semiconductor and IC Package Thermal Metrics.

5.5 Thermal Information: TLV9061S

THERMAL METRIC(1)

TLV9061S

UNIT

DBV (SOT-23)

DRY (USON)

6 PINS

RθJA

Junction-to-ambient thermal resistance

216.5

TBD

°C/W

RθJC(top)

Junction-to-case (top) thermal resistance

155.1

TBD

°C/W

RθJB

Junction-to-board thermal resistance

96.2

TBD

°C/W

ψJT

Junction-to-top characterization parameter

80.3

TBD

°C/W

ψJB

Junction-to-board characterization parameter

95.9

TBD

°C/W

RθJC(bot)

Junction-to-case (bottom) thermal resistance

N/A

°C/W

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics.

5.6 Thermal Information: TLV9062

THERMAL METRIC(1)

TLV9062

UNIT

D (SOIC)

DGK (VSSOP)

DSG (WSON)

PW (TSSOP)

DDF (SOT-23)

8 PINS

RθJA

Junction-to-ambient thermal

resistance

157.6

201.2

94.4

205.1

184.4

°C/W

RθJC(top)

Junction-to-case (top) thermal

resistance

104.6

85.7

116.5

93.7

112.8

°C/W

RθJB

Junction-to-board thermal

resistance

99.7

122.9

61.3

135.7

99.9

°C/W

ψJT

Junction-to-top

characterization parameter

55.6

21.2

25.0

18.7

°C/W

ψJB

Junction-to-board

characterization parameter

99.2

121.4

61.7

134.0

99.3

°C/W

RθJC(bot)

Junction-to-case (bottom)

thermal resistance

N/A

34.4

N/A

°C/W

(1)

For more information about traditional and new thermal metrics, see Semiconductor and IC Package Thermal Metrics.

TLV9061, TLV9062, TLV9064

SBOS839M – MARCH 2017 – REVISED DECEMBER 2024

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