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LM5145 Datasheet(PDF) 71 Page - Texas Instruments |
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LM5145 Datasheet(HTML) 71 Page - Texas Instruments |
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71 / 73 page  www.ti.com EXAMPLE BOARD LAYOUT (R0.05) TYP 0.07 MAX ALL AROUND 0.07 MIN ALL AROUND 2X (1) 28X (0.5) 36X (0.6) 32X (0.25) (5.8) (5.8) ( 3.3) ( 0.2) TYP VIA (0.575) (0.825) (0.575) (0.825) 4X (0.27) PINS 3, 24, 29 & 34 2X (1) VQFN - 1 mm max height RHA0036D PLASTIC QUAD FLATPACK - NO LEAD 4230454/A 02/2024 NOTES: (continued) 4. This package is designed to be soldered to a thermal pad on the board. For more information, see Texas Instruments literature number SLUA271 (www.ti.com/lit/slua271). 5. Vias are optional depending on application, refer to device data sheet. If any vias are implemented, refer to their locations shown on this view. It is recommended that vias under paste be filled, plugged or tented. SYMM PKG LAND PATTERN EXAMPLE EXPOSED METAL SHOWN SCALE: 15X SEE SOLDER MASK DETAIL 1 9 10 17 18 26 27 36 37 METAL EDGE SOLDER MASK OPENING EXPOSED METAL METAL UNDER SOLDER MASK SOLDER MASK OPENING EXPOSED METAL NON SOLDER MASK DEFINED (PREFERRED) SOLDER MASK DEFINED SOLDER MASK DETAILS |
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