CC2564MODACMOG datasheet(33/68 Pages) TI2

Part #	CC2564MODACMOG

Description	CC2564MODx Bluetooth® Host Controller Interface (HCI) Module

PDF	68 Pages

Scroll/Zoom	100%

Manufacturer	TI2 [Texas Instruments]

Direct Link	https://www.ti.com

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33 / 68 page

CC2564MODN, CC2564MODA

www.ti.com

SWRS160E – FEBRUARY 2014 – REVISED JANUARY 2017

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Product Folder Links: CC2564MODN CC2564MODA

Applications, Implementation, and Layout

Figure 6-3. PCB Stack-Up

TI recommends a board thickness of 62.4 mils and a substrate dielectric of 4.2. For details, see Table 6-1.

NOTE

These parameters are used for the 50-Ω impedance matching of the RF trace. For more

information, see Section 6.2.1.2.

Table 6-1. Recommended PCB Properties

ITEM

VALUE

Solder mask

0.4 mil

TOP copper + plating

1 oz/1.4 mil

PP (substrate)

10 mil

L2 copper + plating

1 oz/1.4 mil

Core (substrate)

36 mil

L3 copper + plating

1 oz/1.4 mil

PP (substrate)

10 mil

Bottom copper + plating

1 oz/1.4 mil

Solder mask

0.4 mil

Final thickness

62.4 mil = 1.585 mm

CC2564MODACMOG Datasheet(PDF) 33 Page - Texas Instruments