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CC2564MODACMOG Datasheet(PDF) 39 Page - Texas Instruments

Part # CC2564MODACMOG
Description  CC2564MODx Bluetooth® Host Controller Interface (HCI) Module
PDF  68 Pages
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Manufacturer  TI2 [Texas Instruments]
Direct Link  https://www.ti.com
Logo TI2 - Texas Instruments

CC2564MODACMOG Datasheet(HTML) 39 Page - Texas Instruments

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CC2564MODN, CC2564MODA
www.ti.com
SWRS160E – FEBRUARY 2014 – REVISED JANUARY 2017
Submit Documentation Feedback
Product Folder Links: CC2564MODN CC2564MODA
Applications, Implementation, and Layout
Copyright © 2014–2017, Texas Instruments Incorporated
6.2.1.4.2 Ground
The common ground must be the solid ground plane in Layer 2. TI recommends using a large ground pad
under and around the module and placing enough ground vias beneath for a stable system and thermal
dissipation (see Figure 6-11).
Figure 6-11. Using a Large Ground Pad Under the Module
6.2.1.5
Clock Guidelines
Remember that clock signal routing directly influences RF performance because of the signal trace
susceptibility to noise.
6.2.1.5.1 Slow Clock
TI recommends the following guidelines:
•
Keep the slow clock signal lines as short as possible and at least 4-mils wide.
•
Traces of slow clock signals must have a ground plane on each side of the signal trace to reduce
undesired signal coupling.
•
To reduce the capacitive coupling of undesired signals into the clock line, do not route slow clock
traces above or below other signals (especially digital signals). Figure 6-12 shows the slow clock trace
in the TI reference design.



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