CC2564MODACMOG datasheet(46/68 Pages) TI2

46 / 68 page

CC2564MOD x yyy z

PREFIX

X = Experimental device

Blank = Qualified device

DEVICE

Bluetooth® Host Controller

Interface (HCI) Module

DEVICE VARIANT

A = CC2564MODA

N = CC2564MODN

R = Large reel

T = Small reel

PACKAGE

MOE = QFM 33

MOG = QFM 35

CC2564MODN, CC2564MODA

SWRS160E – FEBRUARY 2014 – REVISED JANUARY 2017

www.ti.com

Submit Documentation Feedback

Product Folder Links: CC2564MODN CC2564MODA

Device and Documentation Support

7.3

Device Nomenclature

To designate the stages in the product development cycle, TI assigns prefixes to the part numbers of all

microprocessors (MPUs) and support tools. Each device has one of three prefixes: X, P, or null (no prefix)

(for example, CC2564MODNCMOER). Texas Instruments recommends two of three possible prefix

designators for its support tools: TMDX and TMDS. These prefixes represent evolutionary stages of

product development from engineering prototypes (TMDX) through fully qualified production devices and

tools (TMDS).

Device development evolutionary flow:

Experimental device that is not necessarily representative of the final device's electrical

specifications and may not use production assembly flow.

Prototype device that is not necessarily the final silicon die and may not necessarily meet

final electrical specifications.

null

Production version of the silicon die that is fully qualified.

For orderable part numbers of CC2564MODx devices in the MOE and MOG package types, see the

Package Option Addendum of this document, ti.com, or contact your TI sales representative.

Figure 7-1. Device Nomenclature

7.4

Documentation Support

To receive notification of documentation updates, navigate to the device product folder on ti.com. In the

upper right corner, click on Alert me to register and receive a weekly digest of any product information that

has changed. For change details, review the revision history included in any revised document.

The current documentation that describes the DSP, related peripherals, and other technical collateral is

listed below.

Application Report

Using TI Technology to Simplify Bluetooth® Pairing Via NFC

Bluetooth®

pairing

usually

involves

some level of user interaction to confirm the identity of the user and/or the devices

themselves. There are many pairing mechanisms available across the versions of Bluetooth

(v2.0 through v4.0). This process is typically lengthy and sometimes confusing to the user,

and so this application report is aimed at showing TI technology developers details on

implementing a simplified pairing scheme method outlined by the NFC Forum using an

MSP430F5529 (a TI ultra-low power MCU), a TRF7970A (a TI NFC transceiver IC), and an

CC2560 (a TI Bluetooth radio IC).

User's Guides

Dual-Mode Bluetooth® Stack on STM32F4 MCUs TI’s dual-mode Bluetooth® stack on STM32F4 MCUs

(CC256XSTBTBLESW) software for Bluetooth + Bluetooth low energy enables the STM32

ARM® Cortex®-M4 processor and includes single mode and dual mode, while implementing

the Bluetooth 4.0 specification. The Bluetooth stack is fully qualified (QDID 69887 and QDID

69886) and provides simple command-line applications to help speed development and can

be MFI capable.

CC2564MODACMOG Datasheet(PDF) 46 Page - Texas Instruments

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