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TAS5802PWPR Datasheet(PDF) 5 Page - Texas Instruments |
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TAS5802PWPR Datasheet(HTML) 5 Page - Texas Instruments |
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5 / 106 page  5 Specifications 5.1 Absolute Maximum Ratings Free-air room temperature 25°C (unless otherwise noted) (1) MIN MAX UNIT DVDD Low-voltage digital supply –0.3 3.9 V PVDD PVDD supply –0.3 23 V VI(DigIn) DVDD referenced digital inputs(2) –0.5 VDVDD + 0.5 V VI(SPK_OUTxx) Voltage at speaker output pins –0.3 25 V TA Ambient operating temperature, –40 85 °C TJ Operating junction temperature -40 160 °C Tstg Storage temperature –40 125 °C (1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. (2) DVDD referenced digital pins include: ADR/FAULT, LRCLK, SCLK, SDIN, SDOUT, SCL, SDA, PDN 5.2 ESD Ratings VALUE UNIT V(ESD) Electrostatic discharge Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1) ±2000 V Charged-device model (CDM), per JEDEC specification JESD22-C101(2) ±500 (1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. (2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process. 5.3 Recommended Operating Conditions Over operating free-air temperature range (unless otherwise noted) see (1) MIN NOM MAX UNIT V(POWER) Power supply inputs DVDD 1.62 3.63 V PVDD 4.5 20 VIH(DigIn) Input logic high for DVDD referenced digital inputs 0.9 × VDVDD DVDD V VIL(DigIn) Input logic low for DVDD referenced digital inputs 0.1 × VDVDD V LOUT Minimum inductor value in LC filter under short-circuit condition 1 µH (1) The Max Recommended PVDD value is limited by OCETHRES. 5.4 Thermal Information THERMAL METRIC(1) TAS5802 TSSOP28 (PWP) 28 PINS UNIT JEDEC STANDARD 4-LAYER PCB RθJA Junction-to-ambient thermal resistance 27.9 °C/W RθJC(top) Junction-to-case (top) thermal resistance 19.9 °C/W RθJB Junction-to-board thermal resistance 7.9 °C/W ψJT Junction-to-top characterization parameter 0.2 °C/W ψJB Junction-to-board characterization parameter 7.9 °C/W RθJC(bot) Junction-to-case (bottom) thermal resistance 1.9 °C/W (1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report. www.ti.com TAS5802 SLASFB7A – NOVEMBER 2024 – REVISED AUGUST 2025 Copyright © 2025 Texas Instruments Incorporated Submit Document Feedback 5 Product Folder Links: TAS5802 |
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