MSMCGLCE6.5A – MXLSMCGLCE170Ae3, MSMCJLCE6.5A – MXLSMCJLCE170Ae3

Maximum Ratings

 Data Sheet

© 2013-2026 Microchip Technology Inc. and its subsidiaries

DS00005170C - 3

1.

Maximum Ratings

Table 1-1. Maximum Ratings at 25 °C Unless Otherwise Stated

Parameters/Test Conditions

Symbol

Value

Unit

Junction and storage temperature

TJ and TSTG

–65 to +150

°C

Thermal resistance junction-to-lead1

RӨJL

20

°C/W

Peak pulse power dissipation at 25 °C (at 10/1000 μs, see Figure 4-1,

Figure 4-2, and Figure 4-3 )2

PPP

1500

W

Impulse repetition rate (duty factor)

df

0.01 or less

%

tclamping (0 volts to V(BR) min.)

tclamping

< 5x10–9

s

Rated average power dissipation

TL = +50 °C

TA = 25 °C

PM(AV)

5.0

1.5

W

Solder temperature at 10 s

TSP

260

°C

Notes: 

1. Typical junction to lead (tab) at mounting plane

2. With a repetition rate of 0.01% or less. When pulse testing, do not pulse in opposite direction

(see Application Schematics herein and Figure 5-2 and Figure 5-3 for further protection in both

directions.)

1.1.

Mechanical and Packaging

• Case: Void-free transfer molded thermosetting epoxy body meeting UL94V-0

• Terminals: Tin-lead or RoHS compliant annealed matte-tin plating. Solderable to MIL-STD-750,

method 2026

• Marking: Part number with abbreviated prefix (MCLC6.5A, MCLC6.5Ae3, MCLC33, MCLC33e3, etc.)

• Polarity: Cathode indicated by band

• Tape and reel option: Standard per EIA-481-B with 16 mm tape (add “TR” suffix to part number).

Consult factory for quantities.

• Weight: Approximately 0.25 grams

• See Package Dimensions