RY8411

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Standoff 42V 1.2A 800KHz Sync Step-Down Regulator

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Statistical Quality Control (SQC) methods. All limits are used to calculate Average Outgoing Quality Level (AOQL).

Thermal Information

Item

Description

Value

Unit

RθJA

Junction-to-ambient thermal resistance (1)(2)

105

°C/W

RθJC(top)

Junction-to-case (top) thermal resistance

55

°C/W

RθJB

Junction-to-board thermal resistance

17.5

°C/W

ψJT

Junction-to-top characterization parameter

3.5

°C/W

ψJB

Junction-to-board characterization parameter

17.5

°C/W

Note (1): The package thermal impedance is calculated in accordance to JESD 51-7.

Note (2): Thermal Resistances were simulated on a 4-layer, JEDEC board.

Electrical Characteristics (1) (2)

VIN=12V, TA=25°C, unless otherwise specified.

Parameter

Test Conditions

Min

Typ.

Max

Unit

Input Voltage Range

4

38

V

Supply Current (Quiescent)

VEN =3.0V

0.4

0.8

mA

Supply Current (Shutdown)

VEN =0 or EN = GND

10

uA

Feedback Voltage

0.780

0.800

0.820

V

High-Side Switch On-Resistance

ISW=100mA

250

mΩ

Low-Side Switch On-Resistance

ISW=-100mA

150

mΩ

Upper Switch Current Limit

2

A

Over Voltage Protection Threshold

39

V

Switching Frequency

800

KHz

Maximum Duty Cycle

VFB=90%

92

%

Minimum On-Time

90

nS

EN Rising Threshold

1.3

V

EN Falling Threshold

0.9

V

Under-Voltage Lockout Threshold

Wake up VIN Voltage

3.6

3.8

V

Shutdown VIN Voltage

3.1

3.3

V

Hysteresis VIN voltage

300

mV

Soft Start

1

mS

Thermal Shutdown

150

℃

Thermal Hysteresis

20

℃

Note (1): MOSFET on-resistance specifications are guaranteed by correlation to wafer level measurements.

Note (2): Thermal shutdown specifications are guaranteed by correlation to the design and characteristics analysis.