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FDMA1023PZ Datasheet(PDF) 4 Page - ON Semiconductor |
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FDMA1023PZ Datasheet(HTML) 4 Page - ON Semiconductor |
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4 / 9 page ![]() FDMA1023PZ Rev.C4 www.fairchildsemi.com 3 Notes: 1: R JA is determined with the device mounted on a 1 in 2 oz. copper pad on a 1.5 x 1.5 in. board of FR-4 material. R JCis guaranteed by design while R JA is determined by the user's board design. (a) R JA = 86°C/W when mounted on a 1in 2 pad of 2 oz copper, 1.5" x 1.5" x 0.062" thick PCB. For single operation. (b) R JA = 173°C/W when mounted on a minimum pad of 2 oz copper. For single operation. (c) R JA = 69 oC/W when mounted on a 1in2 pad of 2 oz copper, 1.5” x 1.5” x 0.062” thick PCB, For dual operation. (d) R JA = 151 oC/W when mounted on a minimum pad of 2 oz copper. For dual operation. 2: Pulse Test : Pulse Width < 300us, Duty Cycle < 2.0% 3: The diode connected between the gate and source serves only as protection against ESD. No gate overvoltage rating is implied. a) 86oC/W when mounted on a 1 in2 pad of 2 oz copper. b) 173oC/W when mounted on a minimum pad of 2 oz copper. c) 69oC/W when mounted on a 1 in2 pad of 2 oz copper. d) 151oC/W when mounted on a minimum pad of 2 oz copper. |
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