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RZ/N2L Datasheet(PDF) 90 Page - Renesas Technology Corp

Part # RZ/N2L
Description  RZ Arm-based High-end 32 & 64-bit MPUs
PDF  128 Pages
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Manufacturer  RENESAS [Renesas Technology Corp]
Direct Link  http://www.renesas.com
Logo RENESAS - Renesas Technology Corp

RZ/N2L Datasheet(HTML) 90 Page - Renesas Technology Corp

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Table 2.36
xSPI timing
Parameter
Symbol
1.8 V
3.3 V
Unit
Reference
figure
Min.
Max.
Min.
Max.
Cycle time
SDR
tPERIOD
7.5
—
13.3
—
ns
Figure 2.73
DDR
10.0
—
13.3
—
ns
Clock output slew rate
tSRck
0.75/0.56*2
—
0.56
—
V/ns
Clock duty cycle distortion
tCKDCD
0.0
tPERIOD ×
0.05
0.0
tPERIOD
× 0.05
ns
Clock minimum pulse width
tCKMPW
tPERIOD ×
0.45
—
tPERIOD ×
0.45
—
ns
Differential clock crossing voltage
VOX(AC) 0.4 × VCC18 0.6 × VCC18 —
—
V
DS duty cycle distortion
tDSDCD
0.0
tPERIOD ×
0.04
0.0
tPERIOD
× 0.04
ns
DS minimum pulse width
tDSMPW
tPERIOD ×
0.41
—
tPERIOD ×
0.41
—
ns
Data input/output slew rate
tSR
0.75/0.56*2
—
0.56
—
V/ns
Data input setup time (to CK)
SDR
tSU
2.0
—
2.4
—
ns
Figure 2.74
Data input hold time (to CK)
tH
1.0
—
1.0
—
ns
Data output delay time
tOD
—
1.0*3
—
1.4*3
ns
Data output hold time
tOH
-1.0
—
-2.3
—
ns
Data output buffer off time
tBOFF
-1.0
—
-2.3
—
ns
Data input setup time (to DS)
DDR*1
*3
tSU
-0.8
—
-0.8
—
ns
Figure 2.75,
Figure 2.76
Data input hold time (to DS)
tH
tPERIOD ×
0.41 - 0.8
—
tPERIOD ×
0.41 - 0.8
—
ns
Data output setup time (to CK)
tSUO
1.0
—
1.0
—
ns
Data output hold time (to CK)
tHO
1.0
—
1.0
—
ns
CS low to clock high
tCSLCKH 6.0/8.0*2 *4
—
8.0*4
—
ns
Figure 2.74
to Figure
2.76
Clock low to CS high
tCKLCSH 6.0/8.0*2
—
8.0
—
ns
CS high time
tCSTD
1
16
1
16
tPERIOD
DS low to CS high
tDSLCSH 6.0/8.0*2 *5
—
10.6*5
—
ns
Figure 2.77
CS high to DS tri-state
tCSHDST 0.0
tPERIOD
0.0
tPERIOD
ns
CS low to DS low *8
tCSLDSL
0.0
16.0 *9
0.0
20.0 *9
ns
DS tri-state to CS low
tDSTCSL 0.0
—
0.0
—
ns
CK low to DS low *6
tCKLDSL
—
(0.45 + e) ×
tPERIOD - 2 *7
—
(0.45 +
e) ×
tPERIOD
- 2 *7
ns
Note 1. The DS shift setting (WRAPCFG.DSSFTCSx[4:0]) is 01000b for xSPI200.
Note 2. Specification at 133 MHz / Specification at 100 MHz
Note 3. These are values when the OEN assertion is extended in the Output Enable Asserting extension bit (COMCFG.OEASTEX = 1).
Note 4. These are the values when the CS assertion is extended in the CS asserting extension bit (LIOCFGCSn.CSASTEX = 1).
Note 5. These are the values when the tCKLDSL constraint is satisfied.
Note 6. This constraint is necessary only to satisfy the tDSLCSH requirement in JESD251, which specifies that tDSLCSH must be at least 80%
of tPERIOD. Set LIOCFGCSn.CSNEGEX to the appropriate value to ensure the memory specification complies with this constraint.
Note 7. e = LIOCFGCSn.CSNEGEX
Note 8. If the DS is high during the command and modifier phase when using JESD251 Profile 2.0 memory, the time from CS low to DS
high must also meet this specification.
Note 9. When using JESD251 Profile 1.0 memory or JESD251 Profile 2.0 memory with LIOCFGCSn.LATEMD set to 0, this constraint does
not apply if the internal pull-down resistor of the DS pin is enabled.
RZ/N2L Datasheet
2. Electrical Characteristics
R01DS0397EJ0140 Rev.1.40
Mar 31, 2026
Page 90 of 128



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