TC211

192-

× 165-PIXEL CCD IMAGE SENSOR

SOCS008B – JANUARY 1990

Copyright

2-1

POST OFFICE BOX 655303

Vertical Transfers

Burn-In, Residual Imaging, Image

Distortion, Image Lag, or Microphonics

– 2640

µm by 2640 µm

– 192 Pixels (H) by 165 Pixels (V)

– Each Pixel 13.75

µm (H) by 16 µm (V)

description

The TC211 is a full-frame charge-coupled device (CCD) image sensor designed specifically for industrial

applications requiring ruggedness and small size. The image-sensing area is configured into 165 horizontal

lines each containing 192 pixels. Twelve additional pixels are provided at the end of each line to establish a dark

reference and line clamp. The antiblooming feature is activated by supplying clock pulses to the antiblooming

gate, an integral part of each image-sensing element. The charge is converted to signal voltage at 4

µV per

electron by a high-performance structure with built-in automatic reset and a voltage-reference generator. The

signal is further buffered by a low-noise two-stage source-follower amplifier to provide high output-drive

capability.

The TC211 is supplied in a 6-pin dual-in-line ceramic package approximately 7,5 mm (0.3 in.) square. The glass

window can be cleaned using any standard method for cleaning optical assemblies or by wiping the surface with

a cotton swab soaked in alcohol.

The TC211 is characterized for operation from – 10

°C to 45°C.

This MOS device contains limited built-in gate protection. During storage or handling, the device leads should be shorted together

or the device should be placed in conductive foam. In a circuit, unused inputs should always be connected to VSS. Under no

circumstances should pin voltages exceed absolute maximum ratings. Avoid shorting OUT to VSS during operation to prevent

damage to the amplifier. The device can also be damaged if the output terminals are reverse-biased and an excessive current is

allowed to flow. Specific guidelines for handling devices of this type are contained in the publication

Guidelines for Handling

Electrostatic-Discharge-Sensitive (ESDS) Devices and Assemblies available from Texas Instruments.

ADB

VSS

ABG

OUT

SRG

IAG

4

5

6

3

2

1

DUAL-IN-LINE PACKAGE

(TOP VIEW)

PRODUCTION DATA information is current as of publication date.

Products conform to specifications per the terms of Texas Instruments

standard warranty. Production processing does not necessarily include

testing of all parameters.