SE97BTP datasheet(2/53 Pages) NXP

2 / 53 page

SE97B_1

Product data sheet

Rev. 01 — 27 January 2010

2 of 53

NXP Semiconductors

SE97B

DDR memory module temp sensor with integrated SPD

Features

2.1 General features

JEDEC (JC-42.4) DIMM temperature sensor plus 256-byte serial EEPROM for Serial

Presence Detect (SPD)

SDA open-drain output design for best operation in distributed multi-point applications

Shutdown current: 0.1

μA (typ.) and 5.0 μA (max.)

Power-on reset: 1.8 V (typ.)

2-wire interface: I2C-bus/SMBus compatible, 0 Hz to 400 kHz

SMBus Alert Response Address and TIMEOUT 25 ms to 35 ms (programmable)

ESD protection exceeds 2500 V HBM per JESD22-A114, 250 V MM per

JESD22-A115, and 1000 V CDM per JESD22-C101

Latch-up testing is done to JEDEC Standard JESD78 which exceeds 100 mA

Available in HWSON8 package

2.2 Temperature sensor features

11-bit ADC Temperature-to-Digital converter with 0.125

°C resolution

Voltage range: 3.0 V to 3.6 V

Operating current: 250

μA (typ.) and 400 μA (max.)

Table 1.

Comparison of SE97 versus SE97B features

Feature

SE97

SE97B

JEDEC specification

old JEDEC specification

new JEDEC specification

Bit 8 ‘1’ Thermal Sensor shutdown

no SMBus Timeout

SMBus Timeout 25 ms to 35 ms

Bit 8 ‘0’ Thermal Sensor active

SMBus Timeout 25 ms to 35 ms

I2C-bus maximum frequency

400 kHz

I2C SCL and SDA VIL/VIH voltage levels

VIL(max) =0.3 × VDD; VIH(min) =0.7 × VDD

Capabilities bit 6 SMBus Timeout

set to 0

set to 1

EVENT pin operation

frozen

de-assert

Capabilities bit 7 EVENT pin

set to 0

set to 1

A0 pin is 10 V tolerant

yes

Capabilities bit 5 VHV

set to 0

set to 1

I2C spike suppression

50 ns

I2C input hysteresis

0.05

× V

SE97 Device ID register

1010 0010

Revision ID register

0000 0001

0000 0011

Temperature Sensor accuracy

Grade B

Improved Grade B

Power-On Reset (POR)

0.6 V

1.8 V

Temperature Sensor voltage range

3.0 V to 3.6 V

EEPROM Write voltage range

3.0 V to 3.6 V

EEPROM Read voltage range

1.7 V to 3.6 V

3.0 V to 3.6 V

2mm

× 3mm × 0.8 mm package

assembly plant Hong Kong

assembly plant Bangkok

(thicker die and leadframe)

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