SE97BTP datasheet(3/53 Pages) NXP

3 / 53 page

SE97B_1

Product data sheet

Rev. 01 — 27 January 2010

3 of 53

NXP Semiconductors

SE97B

DDR memory module temp sensor with integrated SPD

Programmable hysteresis threshold: off, 0

°C, 1.5 °C, 3 °C, 6 °C

Over/under/critical temperature EVENT output

B-grade accuracy:

±0.5 °C/±1 °C (typ./max.) → +75 °C to +95 °C

±1.0 °C/±2 °C (typ./max.) → +40 °C to +125 °C

±2.0 °C/±3 °C (typ./max.) →−40 °C to +125 °C

2.3 Serial EEPROM features

Read and write voltage range: 3.0 V to 3.6 V

Operating current:

Write

→ 0.6 mA (typ.) for 3.5 ms (typ.)

Read

→ 100 μA (typ.)

Organized as 1 block of 256 bytes (256

× 8)

100,000 write/erase cycles and 10 years of data retention

Permanent and Reversible Software Write Protect

Software Write Protection for the lower 128 bytes

Applications

DDR2 and DDR3 memory modules

Laptops, personal computers and servers

Enterprise networking

Hard disk drives and other PC peripherals

Ordering information

[1]

Industry standard 2 mm

× 3mm × 0.8 mm package to JEDEC WCE-3, PSON8 in 8 mm × 4 mm pitch tape 4 k quantity reels.

Table 2.

Ordering information

Type number

Topside

mark

Package

Name

Description

Version

SE97BTP[1]

97B

HWSON8

plastic thermal enhanced very very thin small outline package;

no leads; 8 terminals; body 2

× 3 × 0.8 mm

SOT1069-2

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