PCF2123TS datasheet(42/55 Pages) NXP

42 / 55 page

PCF2123_2

Product data sheet

Rev. 02 — 4 December 2009

42 of 55

NXP Semiconductors

PCF2123

SPI Real time clock/calendar

14. Package outline

Fig 30. Package outline SOT402-1 (TSSOP14) of PCF2123TS

UNIT

cD (1)

E (2)

(1)

eHE

LLp

REFERENCES

OUTLINE

VERSION

EUROPEAN

PROJECTION

ISSUE DATE

IEC

JEDEC

JEITA

0.15

0.05

0.95

0.80

0.30

0.19

0.2

0.1

5.1

4.9

4.5

4.3

0.65

6.6

6.2

0.4

0.3

0.72

0.38

0.13

0.1

0.2

DIMENSIONS (mm are the original dimensions)

Notes

1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.

2. Plastic interlead protrusions of 0.25 mm maximum per side are not included.

0.75

0.50

SOT402-1

MO-153

99-12-27

03-02-18

w M

b p

0.25

L p

detail X

(A )

v M A

2.5

5 mm

scale

TSSOP14: plastic thin shrink small outline package; 14 leads; body width 4.4 mm

SOT402-1

max.

1.1

pin 1 index

PCF2123TS Datasheet(PDF) 42 Page - NXP Semiconductors

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