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PCF2123TS Datasheet(PDF) 43 Page - NXP Semiconductors |
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PCF2123TS Datasheet(HTML) 43 Page - NXP Semiconductors |
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43 / 55 page ![]() PCF2123_2 © NXP B.V. 2009. All rights reserved. Product data sheet Rev. 02 — 4 December 2009 43 of 55 NXP Semiconductors PCF2123 SPI Real time clock/calendar Fig 31. Package outline SOT758-1 (HVQFN16) of PCF2123BS terminal 1 index area 0.5 1 A1 Eh b UNIT y e 0.2 c REFERENCES OUTLINE VERSION EUROPEAN PROJECTION ISSUE DATE IEC JEDEC JEITA mm 3.1 2.9 Dh 1.75 1.45 y1 3.1 2.9 1.75 1.45 e1 1.5 e2 1.5 0.30 0.18 0.05 0.00 0.05 0.1 DIMENSIONS (mm are the original dimensions) SOT758-1 MO-220 - - - - - - 0.5 0.3 L 0.1 v 0.05 w 0 2.5 5 mm scale SOT758-1 HVQFN16: plastic thermal enhanced very thin quad flat package; no leads; 16 terminals; body 3 x 3 x 0.85 mm A(1) max. A A1 c detail X y y1 C e L Eh Dh e e1 b 58 16 13 12 9 4 1 X D E C B A e2 02-03-25 02-10-21 terminal 1 index area 1/2 e 1/2 e A C C B v M w M E(1) Note 1. Plastic or metal protrusions of 0.075 mm maximum per side are not included. D(1) |
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