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PPC8567ECVTAQJGA Datasheet(PDF) 126 Page - Freescale Semiconductor, Inc |
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PPC8567ECVTAQJGA Datasheet(HTML) 126 Page - Freescale Semiconductor, Inc |
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126 / 139 page  MPC8568E/MPC8567E PowerQUICC III Integrated Processor Hardware Specifications, Rev. 1 126 Freescale Semiconductor Thermal system-level design—the heat sink, airflow, and thermal interface material. The recommended attachment method to the heat sink is illustrated in Figure 69. The heat sink should be attached to the printed-circuit board with the spring force centered over the die. This spring force should not exceed 10 pounds force. Figure 69. Package Exploded Cross-Sectional View with Several Heat Sink Options The system board designer can choose between several types of heat sinks to place on the device. There are several commercially-available heat sinks from the following vendors: Aavid Thermalloy 603-224-9988 80 Commercial St. Concord, NH 03301 Internet: www.aavidthermalloy.com Advanced Thermal Solutions 781-769-2800 89 Access Road #27. Norwood, MA02062 Internet: www.qats.com Alpha Novatech 408-749-7601 473 Sapena Ct. #15 Santa Clara, CA 95054 Internet: www.alphanovatech.com International Electronic Research Corporation (IERC) 818-842-7277 413 North Moss St. Burbank, CA 91502 Internet: www.ctscorp.com Millennium Electronics (MEI) 408-436-8770 Loroco Sites 671 East Brokaw Road San Jose, CA 95112 Internet: www.mei-millennium.com Ultimately, the final selection of an appropriate heat sink depends on many factors, such as thermal performance at a given air velocity, spatial volume, mass, attachment method, assembly, and cost. Several heat sinks offered by Aavid Thermalloy, Advanced Thermal Solutions, Alpha Novatech, IERC, and Thermal Interface Material Heat Sink FC-PBGA Package Heat Sink Clip Printed-Circuit Board Die |
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