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LPC1850 Datasheet(PDF) 39 Page - NXP Semiconductors |
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LPC1850 Datasheet(HTML) 39 Page - NXP Semiconductors |
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39 / 84 page ![]() LPC1850_30_20_10 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved. Objective data sheet Rev. 1 — 3 January 2011 39 of 84 NXP Semiconductors LPC1850/30/20/10 32-bit ARM Cortex-M3 microcontroller commands and command formats. SPIFI provides sufficient flexibility to be compatible with common flash devices and includes extensions to help insure compatibility with future devices. 7.12.3.1 Features • Interfaces to serial flash memory in the main memory map. • Supports classic and 4-bit bidirectional serial protocols. • Half-duplex protocol compatible with various vendors and devices. • Data rates of up to 40 MB per second total. • Supports DMA access. 7.12.4 SD/MMC card interface The SD/MMC card interface supports the following modes to control: • Secure Digital memory (SD version 3.0) • Secure Digital I/O (SDIO version 2.0) • Consumer Electronics Advanced Transport Architecture (CE-ATA version 1.1) • Multimedia Cards (MMC version 4.4) 7.12.5 External Memory Controller (EMC) The LPC1850/30/20/10 EMC is a Memory Controller peripheral offering support for asynchronous static memory devices such as RAM, ROM, and NOR flash. In addition, it can be used as an interface with off-chip memory-mapped devices and peripherals. 7.12.5.1 Features • Dynamic memory interface support including single data rate SDRAM. • Asynchronous static memory device support including RAM, ROM, and NOR flash, with or without asynchronous page mode. • Low transaction latency. • Read and write buffers to reduce latency and to improve performance. • 8/16/32 data and 24 address lines wide static memory support. On parts LPC1820/10 only 8/16 data lines are available. • 16 bit and 32 bit wide chip select SDRAM memory support. • Static memory features include: – Asynchronous page mode read – Programmable Wait States – Bus turnaround delay – Output enable and write enable delays – Extended wait • Four chip selects for synchronous memory and four chip selects for static memory devices. • Power-saving modes dynamically control CKE and CLKOUT to SDRAMs. • Dynamic memory self-refresh mode controlled by software. |
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