MPC8358E datasheet(65/95 Pages) FREESCALE

Part #	MPC8358E

Description	PowerQUICC II Pro Processor Revision 2.1 PBGA Silicon

PDF	95 Pages

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Manufacturer	FREESCALE [Freescale Semiconductor, Inc]

Direct Link	http://www.freescale.com

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MPC8358E PowerQUICC II Pro Processor Revision 2.1 PBGA Silicon Hardware Specifications, Rev. 3

Freescale Semiconductor

Package and Pin Listings

21 Package and Pin Listings

This section details package parameters, pin assignments, and dimensions. The MPC8358E is available in

a plastic ball grid array (PBGA), see Section 21.1, “Package Parameters for the PBGA Package,” and

Section 21.2, “Mechanical Dimensions of the PBGA Package,” for information on the package.

21.1

Package Parameters for the PBGA Package

The package parameters for rev 2.0 silicon are as provided in the following list. The package type is 29

mm x 29 mm, 668 plastic ball grid array (PBGA).

Package outline

29 mm x 29 mm

Interconnects

668

Pitch

1.00 mm

Module height (typical)

1.46 mm

Solder Balls

62 Sn/36 Pb/2 Ag (ZQ package)

95.5 Sn/0.5 Cu/4Ag (VR package)

Ball diameter (typical)

0.64 mm

MPC8358E Datasheet(PDF) 65 Page - Freescale Semiconductor, Inc