MPC8358E datasheet(87/95 Pages) FREESCALE

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MPC8358E PowerQUICC II Pro Processor Revision 2.1 PBGA Silicon Hardware Specifications, Rev. 3

Freescale Semiconductor

Thermal

Table 76 shows heat sinks and junction-to-ambient thermal resistance for PBGA package.

Accurate thermal design requires thermal modeling of the application environment using computational

fluid dynamics software which can model both the conduction cooling and the convection cooling of the

air moving through the application. Simplified thermal models of the packages can be assembled using the

junction-to-case and junction-to-board thermal resistances listed in the thermal resistance table. More

detailed thermal models can be made available on request.

Heat sink vendors include the following:

Aavid Thermalloy

603-224-9988

80 Commercial St.

Concord, NH 03301

Internet: www.aavidthermalloy.com

Alpha Novatech

408-749-7601

473 Sapena Ct. #15

Santa Clara, CA 95054

Internet: www.alphanovatech.com

International Electronic Research Corporation (IERC)

818-842-7277

413 North Moss St.

Burbank, CA 91502

Internet: www.ctscorp.com

Table 76. Heat Sinks and Junction-to-Ambient Thermal Resistance of PBGA Package

Heat Sink Assuming Thermal Grease

Air Flow

× 29 mm PBGA

Thermal Resistance

AAVID 30

× 30 × 9.4 mm Pin Fin

Natural Convection

12.6

AAVID 30

× 30 × 9.4 mm Pin Fin

1 m/s

8.2

AAVID 30

× 30 × 9.4 mm Pin Fin

2 m/s

7.0

AAVID 31

× 35 × 23 mm Pin Fin

Natural Convection

10.5

AAVID 31

× 35 × 23 mm Pin Fin

1 m/s

6.6

AAVID 31

× 35 × 23 mm Pin Fin

2 m/s

6.1

Wakefield, 53

× 53 × 25 mm Pin Fin

Natural Convection

9.0

Wakefield, 53

× 53 × 25 mm Pin Fin

1 m/s

5.6

Wakefield, 53

× 53 × 25 mm Pin Fin

2 m/s

5.1

MEI, 75

× 85 × 12 no adjacent board, extrusion

Natural Convection

9.0

MEI, 75

× 85 × 12 no adjacent board, extrusion

1 m/s

5.7

MEI, 75

× 85 × 12 no adjacent board, extrusion

2 m/s

5.1

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