MSP430F4250IDL datasheet(27/63 Pages) TI

27 / 63 page

MSP430F42x0

MIXED SIGNAL MICROCONTROLLER

SLAS455D − MARCH 2005 − REVISED APRIL 2007

POST OFFICE BOX 655303

• DALLAS, TEXAS 75265

electrical characteristics over recommended operating free-air temperature (unless otherwise

noted)

crystal oscillator, LFXT1 oscillator (see Notes 1 and 2)

PARAMETER

TEST CONDITIONS

MIN

TYP

MAX

UNIT

OSCCAPx = 0h, VCC = 2.2 V / 3 V

Integrated input capacitance

OSCCAPx = 1h, VCC = 2.2 V / 3 V

CXIN

Integrated input capacitance

(see Note 4)

OSCCAPx = 2h, VCC = 2.2 V / 3 V

OSCCAPx = 3h, VCC = 2.2 V / 3 V

OSCCAPx = 0h, VCC = 2.2 V / 3 V

Integrated output capacitance

OSCCAPx = 1h, VCC = 2.2 V / 3 V

CXOUT

Integrated output capacitance

(see Note 4)

OSCCAPx = 2h, VCC = 2.2 V / 3 V

OSCCAPx = 3h, VCC = 2.2 V / 3 V

VIL

Input levels at XIN

2 2 V/3 V (see Note 3)

VSS

0.2

×VCC

VIH

Input levels at XIN

VCC = 2.2 V/3 V (see Note 3)

0.8

×VCC

VCC

NOTES:

1. The parasitic capacitance from the package and board may be estimated to be 2 pF. The effective load capacitor for the crystal is

(CXIN xCXOUT) / (CXIN + CXOUT). This is independent of XTS_FLL.

2. To improve EMI on the low-power LFXT1 oscillator, particularly in the LF mode (32 kHz), the following guidelines should be observed.

− Keep as short of a trace as possible between the ’F42x0 and the crystal.

− Design a good ground plane around the oscillator pins.

− Prevent crosstalk from other clock or data lines into oscillator pins XIN and XOUT.

− Avoid running PCB traces underneath or adjacent to the XIN and XOUT pins.

− Use assembly materials and praxis to avoid any parasitic load on the oscillator XIN and XOUT pins.

− If conformal coating is used, ensure that it does not induce capacitive/resistive leakage between the oscillator pins.

− Do not route the XOUT line to the JTAG header to support the serial programming adapter as shown in other

documentation. This signal is no longer required for the serial programming adapter.

3. Applies only when using an external logic-level clock source. XTS_FLL must be set. Not applicable when using a crystal or

resonator.

4. External capacitance is recommended for precision real-time clock applications; OSCCAPx = 0h.

MSP430F4250IDL Datasheet(PDF) 27 Page - Texas Instruments

MSP430F4250IDL Datasheet(HTML) 27 Page - Texas Instruments

Html Pages

1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50 51 52 53 54 55 56 57 58 59 60 61 62 63

Datasheet Download

Link URL