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MAX15006BASA/V+ Datasheet(PDF) 2 Page - Maxim Integrated Products |
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MAX15006BASA/V+ Datasheet(HTML) 2 Page - Maxim Integrated Products |
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2 / 14 page ![]() 40V, Ultra-Low Quiescent-Current Linear Regulators in 6-Pin TDFN/8-Pin SO 2 Maxim Integrated MAX15006/MAX15007 ABSOLUTE MAXIMUM RATINGS ELECTRICAL CHARACTERISTICS (VIN = 14V, IOUT = 1mA, CIN = 0.1µF, COUT = 2.2µF, TA = TJ = -40°C to +125°C, unless otherwise noted. Typical specifications are at TA = +25°C.) (Note 2) Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. Note 1: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-layer board. For detailed information on package thermal considerations, refer to www.maximintegrated.com/thermal-tutorial. IN to GND ...............................................................-0.3V to +45V EN to GND..............................................................-0.3V to +45V OUT, FB to GND.....................................................-0.3V to +12V OUT Short-Circuit Duration ........................................Continuous Maximum Current Into Any Pin (except IN and OUT) ......±50mA Continuous Power Dissipation (TA = +70°C) TDFN (derate 23.8mW/°C above +70°C) ........................1904mW SO (derate 23.3mW/°C above +70°C)..........................1860mW Operating Temperature Range .........................-40°C to +125°C Junction Temperature ......................................................+150°C Storage Temperature Range .............................-65°C to +150°C Lead Temperature (soldering, 10s) .................................+300°C Soldering Temperature (reflow) .......................................+260°C PACKAGE THERMAL CHARACTERISTICS (Note 1) TDFN Junction-to-Ambient Thermal Resistance ( θJA) ...........42°C/W Junction-to-Case Thermal Resistance ( θJC) ...............8.5°C/W SO Junction-to-Ambient Thermal Resistance ( θJA) ...........43°C/W Junction-to-Case Thermal Resistance ( θJC) ..................7°C/W PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS Input Voltage Range VIN 4 40 V IOUT = 0A (MAX15006A/B/D) 10 17 IOUT = 0A (MAX15006C) 8 15 IOUT = 0A (MAX15007A/B) 11 18 IOUT = 0A (MAX15007C) 9 16 IOUT = 100μA (MAX15006A/B/D) 10.5 18 IOUT = 100μA (MAX15006C) 8.5 16 IOUT = 100μA (MAX15007A/B) 11.5 19 IOUT = 100μA (MAX15007C) 9.5 17 IOUT = 1mA (MAX15006A/B/D) 12 20 IOUT = 1mA (MAX15006C) 10 18 IOUT = 1mA (MAX15007A/B) 13 21 IOUT = 1mA (MAX15007C) 11 19 IOUT = 50mA (MAX15006) 90 150 IOUT = 50mA (MAX15007) 93 150 Ground Current IGND Regulator on, measured at GND IOUT = 60mA (MAX15006D) 110 150 μA Shutdown Supply Current ISHDN Regulator off (MAX15007 only) 3 5 μA |
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