AD9361BBCZ datasheet(15/36 Pages) AD

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Data Sheet

AD9361

Rev. D | Page 15 of 36

ABSOLUTE MAXIMUM RATINGS

Table 11.

Parameter

Rating

VDDx to VSSx

−0.3 V to +1.4 V

VDD_INTERFACE to VSSx

−0.3 V to +3.0 V

VDD_GPO to VSSx

−0.3 V to +3.9 V

Logic Inputs and Outputs to

VSSx

−0.3 V to VDD_INTERFACE + 0.3 V

Input Current to Any Pin

Except Supplies

±10 mA

RF Inputs (Peak Power)

2.5 dBm

TX Monitor Input Power (Peak

Power)

9 dBm

Package Power Dissipation

(TJMAX − TA)/θJA

Maximum Junction

Temperature (TJMAX)

110°C

Operating Temperature Range

−40°C to +85°C

Storage Temperature Range

−65°C to +150°C

REFLOW PROFILE

The AD9361 reflow profile is in accordance with the JEDEC

JESD20 criteria for Pb-free devices. The maximum reflow

temperature is 260°C.

THERMAL RESISTANCE

θJA is specified for the worst-case conditions, that is, a device

soldered in a circuit board for surface-mount packages.

Table 12. Thermal Resistance

Package

Type

Airflow

Velocity

(m/sec)

θJA1,2

θJC1,3

θJB1,4

ΨJT1,2

Unit

144-Ball

CSP_BGA

32.3

9.6

20.2

0.27

°C/W

1.0

29.6

0.43

°C/W

2.5

27.8

0.57

°C/W

Per JEDEC JESD51-7, plus JEDEC JESD51-5 2S2P test board.

Per JEDEC JESD51-2 (still air) or JEDEC JESD51-6 (moving air).

Per MIL-STD 883, Method 1012.1.

Per JEDEC JESD51-8 (still air).

ESD CAUTION

Stresses above those listed under Absolute Maximum Ratings

may cause permanent damage to the device. This is a stress

rating only; functional operation of the device at these or any

other conditions above those indicated in the operational

section of this specification is not implied. Exposure to absolute

maximum rating conditions for extended periods may affect

device reliability.

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