Package and PCB thermal data

VNH5019A-E

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Doc ID 15701 Rev 9

3

Package and PCB thermal data

3.1

MultiPowerSO-30 thermal data

Figure 16.

MultiPowerSO-30™ PC board

Figure 17.

Chipset configuration

Figure 18.

condition

Note:

Layout condition of Rth and Zth measurements (PCB FR4 area= 58 mm x 58 mm, PCB thickness=2 mm, Cu thickness=35 mm, Copper areas:

CHIP 1

CHIP 2

CHIP 3

0

5

10

15

20

25

30

35

40

45

50

0

2

4

6

8

1012

1416

18

RthA

RthB = RthC

RthAB = RthAC

RthBC