TLC2652AMFKB datasheet(3/39 Pages) TI

Part #	TLC2652AMFKB

Description	Advanced LinCMOS PRECISION CHOPPER-STABILIZED OPERATIONAL AMPLIFIERS

PDF	39 Pages

Scroll/Zoom	100%

Manufacturer	TI [Texas Instruments]

Direct Link	http://www.ti.com

Logo

3 / 39 page

TLC2652, TLC2652A, TLC2652Y

Advanced LinCMOS PRECISION CHOPPERSTABILIZED

OPERATIONAL AMPLIFIERS

SLOS019E − SEPTEMBER 1988 − REVISED FEBRUARY 2005

POST OFFICE BOX 655303

• DALLAS, TEXAS 75265

TLC2652Y chip information

This chip, when properly assembled, displays characteristics similar to the TLC2652C. Thermal compression

or ultrasonic bonding may be used on the doped-aluminum bonding pads. Chips may be mounted with

conductive epoxy or a gold-silicon preform.

BONDING PAD ASSIGNMENTS

CHIP THICKNESS: 15 TYPICAL

BONDING PADS: 4

× 4 MINIMUM

TJmax = 150°C

TOLERANCES ARE

±10%.

ALL DIMENSIONS ARE IN MILS.

PIN (7) IS INTERNALLY CONNECTED

TO BACK SIDE OF CHIP.

FOR THE PINOUT, SEE THE FUNCTIONAL

BLOCK DIAGRAM.

(13)

(12)

(11)

(10)

(9)

(8)

(1)

(7)

(5)

(4)

(2)

(14)

TLC2652AMFKB Datasheet(PDF) 3 Page - Texas Instruments