Thermal stress

AN3410

20/28

Doc ID 018890 Rev 1

9

Thermal stress

It is not likely that the layout will be used as is by the customer. The temperatures below are

for guidance only – measurements were taken after 30 minutes operation, in open air, on

the workbench, in a 25.3 °C ambient, 120 V input, 18 LED load. The board axis was

horizontal, board position vertical. L3 was above L2.

Table 2.

Thermal stress

Component

Temperature

L2

40.3

BR1

62.4

Q2

52.5

L1

51.4

L3

46.1

U1

42.3

D1

59.3

C2

32.2