10F202 datasheet(66/88 Pages) MICROCHIP

66 / 88 page

PIC10F200/202/204/206

DS40001239F-page 66

 2004-2014 Microchip Technology Inc.

TABLE 12-6:

THERMAL CONSIDERATIONS

Standard Operating Conditions (unless otherwise specified)

Param.

No.

Sym.

Characteristic

Typ.

Units

Conditions

TH01

JA

Thermal Resistance Junction to

Ambient

C/W 6-pin SOT-23 package

C/W 8-pin PDIP package

C/W 8-pin DFN package

TH02

JC

Thermal Resistance Junction to

Case

31.4

C/W 6-pin SOT-23 package

C/W 8-pin PDIP package

C/W 8-pin DFN package

TH03

TJMAX

Maximum Junction Temperature

150

C

TH04

Power Dissipation

—

PD = PINTERNAL + PI/O

TH05

PINTERNAL Internal Power Dissipation

—

PINTERNAL = IDD x VDD(1)

TH06

PI/O

I/O Power Dissipation

—

PI/O =

 (IOL * VOL) +  (IOH * (VDD - VOH))

TH07

PDER

Derated Power

—

PDER = PDMAX (TJ - TA)/

JA(2)

Note 1: IDD is current to run the chip alone without driving any load on the output pins.

2: TA = Ambient Temperature; TJ = Junction Temperature.

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