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AN4242 Datasheet(PDF) 17 Page - STMicroelectronics

Part # AN4242
Description  New generation of 650 V SiC diodes
PDF  26 Pages
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Manufacturer  STMICROELECTRONICS [STMicroelectronics]
Direct Link  http://www.st.com
Logo STMICROELECTRONICS - STMicroelectronics

AN4242 Datasheet(HTML) 17 Page - STMicroelectronics

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DocID024196 Rev 1
17/26
AN4242
New 650 V JBS SiC diodes
Current stresses in the range of tens of microseconds are usually linked to the switching
period. Such a surge current can also happen during lightning surge tests. Stresses in the
range of tens of milliseconds are usually related to line-dropout tests.
3.3
JBS structure trade-off: current surge capability versus Qrr
The efficiency of the JBS structure to sustain a current spike is linked to the bias current
level of the merged PN junction. This level characterizes “the JBS positioning”. Designing
the diode with a higher bias current level leads to a higher forward voltage drop, and hence
a higher Tj for the same surge. Likewise, the lower the bias current level, the lower the
forward voltage drop at high current. However, the conduction of a PN junction implies some
recovery charges (Qrr) when the diode switches and turns off. This is linked to the minority
carriers’ recombination, which does not happen in a conventional SiC Schottky structure. As
a consequence, a trade off between IFSM and Qrr should be considered.
3.3.1
Forward characteristics comparison between ST’S SiC 2nd generation
and other JBS designs
Figure 15 illustrates in dotted lines another dimensioning of the merged PN junction
compared with ST’s design. The dotted lines present forward voltage drops around 2 volts
higher than ST’s diode between 30 A and 70 A at 225 °C. On the other hand, this
characteristic indicates that the carrier injection phenomenon (Qrr) should appear at higher
forward current levels.
Figure 15. Forward voltage drop between STPSC6H065D and another JBS structure
Table 3. IFSM with tp = 10 ms and Tj = 25°C: comparison between first and second
generation
IFSM, sinusoidal, 10 ms, @ 25 °C
IF (A)
468
10
SiC 1st generation
14
27
30
40
SiC 2nd generation
38
60
75
90
25 °C
225 °C
STPSC6H065D 2G
75 °C
125 °C
175 °C
V
F=f(IF) versus Tj with (tp=50 µs)
020
30
40
50
60
10
70
80
90
100
IF (A)
VF (V)
8
7
6
5
4
3
2
1
0
9
10
11
Other JBS technology



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