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FT905 Datasheet(PDF) 46 Page - Future Technology Devices International Ltd. |
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FT905 Datasheet(HTML) 46 Page - Future Technology Devices International Ltd. |
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46 / 56 page ![]() Copyright © 2014 Future Technology Devices International Limited 46 FT905 _6_7_8/6/7/8 Embedded Microcontroller Datasheet Version 1.0 Document No.: FT_001131 Clearance No.: FTDI#422 7 Package Parameters The FT905 series is available in two different packages. The FT905Q/FT906Q/FT907Q/FT908Q is the QFN-76 package and the FT905L/FT906L/FT907L/FT908L is LQFP-80 package. The dimensions, markings and solder reflow profile for all packages is described in following sections. 7.1 QFN-76 Package Dimensions EXPOSED PAD D2 L MIN. NOM. MAX. E2 MIN. NOM. MAX. MIN. NOM. MAX. DIE PAD 5.56 5.81 6.06 6.06 6.31 6.56 0.30 0.40 0.50 245X265 MIL UNIT: MM Figure 7-1 QFN-76 Package Dimensions Note: On the underside of the package, the exposed thermal pad should be connected to GND. |
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