THS4281

SLOS432B – APRIL 2004 – REVISED OCTOBER 2015

www.ti.com

Table of Contents

7.3

Device Functional Modes........................................ 25

1

Features .................................................................. 1

8

Application and Implementation ........................ 26

2

Applications ........................................................... 1

8.1

Application Information............................................ 26

3

Description ............................................................. 1

8.2

Typical Application ................................................. 27

4

Revision History..................................................... 2

9

Power Supply Recommendations ...................... 29

5

Pin Configuration and Functions ......................... 3

9.1

Power-Supply Decoupling Techniques and

6

Specifications......................................................... 4

Recommendations ................................................... 29

6.1

Absolute Maximum Ratings ..................................... 4

10

Layout................................................................... 29

6.2

ESD Ratings ............................................................ 4

10.1

Layout Guidelines ................................................. 29

6.3

Recommended Operating Conditions ....................... 4

10.2

Layout Examples................................................... 30

6.4

Thermal Information .................................................. 4

10.3

Thermal Considerations ........................................ 31

6.5

11

Device and Documentation Support ................. 33

GND) .......................................................................... 5

11.1

Documentation Support ........................................ 33

6.6

GND) .......................................................................... 7

11.2

Community Resources.......................................... 33

6.7

11.3

Trademarks ........................................................... 33

6.8

Dissipation Ratings ................................................. 11

11.4

Electrostatic Discharge Caution ............................ 33

6.9

Typical Characteristics ............................................ 12

11.5

Glossary ................................................................ 33

7

Detailed Description ............................................ 24

12

Mechanical, Packaging, and Orderable

Information ........................................................... 33

7.1

Overview ................................................................. 24

7.2

Feature Description................................................. 24

4 Revision History

NOTE: Page numbers for previous revisions may differ from page numbers in the current version.

Changes from Revision A (November 2009) to Revision B

Page

•

Added Pin Configuration and Functions section, ESD Ratings table, Feature Description section, Device Functional

Modes, Application and Implementation section, Power Supply Recommendations section, Layout section, Device

and Documentation Support section, and Mechanical, Packaging, and Orderable Information section .............................. 1

•

Removed the Packaging/Ordering Information table ............................................................................................................ 1

•

Removed Design Tools section ............................................................................................................................................. 1

•

Updated Thermal Values ....................................................................................................................................................... 1

•

Removed the Applications Section Contents section .......................................................................................................... 24

•

Removed the Bill of Materials section ................................................................................................................................. 24

Changes from Original (April 2004) to Revision A

Page

•

Updated document format to current standards..................................................................................................................... 1

•

Deleted Lead temperature specification from Absolute Maximum Ratings table................................................................... 4

•

Revised Driving Capacitive Loads section ........................................................................................................................... 26

•

Changed Board Layout section; revised statements in fourth recommendation about how to make connections to

other wideband devices on the board .................................................................................................................................. 29

2

Submit Documentation Feedback

Copyright © 2004–2015, Texas Instruments Incorporated

Product Folder Links: THS4281