0

0.2

0.4

0.6

0.8

1

1.2

1.4

1.6

1.8

−40

−20

0

20

40

60

80

100

8-pin SOIC (D) Package

8-pin MSOP

(DGK) Package

5-pin SOT23

(DBV) Package

THS4281

SLOS432B – APRIL 2004 – REVISED OCTOBER 2015

www.ti.com

Thermal Considerations (continued)

Figure 80. Maximum Power Dissipation vs Ambient Temperature

When determining whether or not the device satisfies the maximum power dissipation requirement, it is important

to consider not only quiescent power dissipation, but also dynamic power dissipation. Often maximum power

dissipation is difficult to quantify because the signal pattern is inconsistent, but an estimate of the RMS value can

provide a reasonable analysis.

32

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