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VND5004DSP30 Datasheet(PDF) 20 Page - STMicroelectronics |
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VND5004DSP30 Datasheet(HTML) 20 Page - STMicroelectronics |
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20 / 28 page ![]() Package and PC board thermal data VND5004DSP30 20/28 DocID027939 Rev 2 4 Package and PC board thermal data 4.1 MultiPowerSO-30 thermal data Figure 24. MultiPowerSO-30 PC board Note: Layout condition of Rth and Zth measurements (PCB: Double layer, Thermal Vias, FR4 area = 58 mm x 58 mm, PCB thickness = 2 mm, Cu thickness = 70 µm (front and back side), Copper areas: from minimum pad lay-out to 4 cm2). Figure 25. Rthj-amb vs PCB copper area in open box free air condition (one channel on) |
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