CD4051B, CD4052B, CD4053B

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SCHS047H – AUGUST 1998 – REVISED APRIL 2015

6 Specifications

6.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)

(1)

MIN

MAX

UNIT

Supply Voltage

–0.5

20

V

DC Input Voltage

–0.5

V

DC Input Current

Any One Input

–10

10

mA

Maximum junction temperature, ceramic package

175

°C

Maximum junction temperature, plastic package

150

°C

Maximum lead temperature, SOIC - Lead Tips Only, Soldering 10s

265

°C

Storage temperature

–65

150

°C

(1)

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended

Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

6.2 ESD Ratings

VALUE

UNIT

CD4051B in PDIP, CDIP, SOIC, SOP, TSSOP Packages

+3000

Electrostatic discharge

V

Charged-device model (CDM), per JEDEC specification JESD22-

+2000

CD4053B in PDIP, CDIP, SOP and TSSOP Packages

+2500

Electrostatic discharge

V

Charged-device model (CDM), per JEDEC specification JESD22-

+1500

(1)

JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

(2)

JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

6.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)

MIN

MAX

UNIT

Temperature Range

–55

125

°C

6.4 Thermal Information

CD405xB

PW

E (PDIP)

M (SOIC)

NS (SOP)

UNIT

(TSSOP)

16 PINS

16 PINS

16 PINS

16 PINS

Junction-to-ambient thermal resistance

67

73

64

108

°C/W

(1)

For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.

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