ADS5400-SP

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SLAS669D – SEPTEMBER 2010 – REVISED JANUARY 2014

THERMAL CHARACTERISTICS

(1)

PARAMETER

TEST CONDITIONS

TYP

UNIT

21.81

°C/W

0.849

°C/W

(1)

This CQFP package has built-in vias that electrically and thermally connect the bottom of the die to a pad on the bottom of the package.

To efficiently remove heat and provide a low-impedance ground path, a thermal land is required on the surface of the PCB directly

underneath the body of the package. During normal surface mount flow solder operations, the heat pad on the underside of the package

is soldered to this thermal land creating an efficient thermal path. Normally, the PCB thermal land has a number of thermal vias within it

that provide a thermal path to internal copper areas (or to the opposite side of the PCB) that provide for more efficient heat removal. TI

typically recommends an 11,9 mm2 board-mount thermal pad. This allows maximum area for thermal dissipation, while keeping leads

away from the pad area to prevent solder bridging. A sufficient quantity of thermal/electrical vias must be included to keep the device

within recommended operating conditions. This pad must be electrically at ground potential.

(2)

(3)

RECOMMENDED OPERATING CONDITIONS

MIN

TYP

MAX

UNIT

SUPPLIES

Analog supply voltage, AVDD5

4.75

5

5.25

V

Analog supply voltage, AVDD3

3.135

3.3

3.465

V

Digital supply voltage, DVDD3

3.135

3.3

3.465

V

ANALOG INPUT

Full-scale differential input range

1.52

2

Input common mode

AVDD5/2

V

DIGITAL OUTPUT

Differential output load

5

pF

CLOCK INPUT

CLK input sample rate (sine wave)

100

1000

MSPS

Clock amplitude, differential

0.6

1.5

Clock duty cycle

45%

50%

55%

Operating case temperature

–55

125

°C

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