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SN74LVC1G34DBVT Datasheet(PDF) 6 Page - Texas Instruments

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Part # SN74LVC1G34DBVT
Description  SN74LVC1G34 Single Buffer Gate
PDF  38 Pages
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Manufacturer  TI1 [Texas Instruments]
Direct Link  http://www.ti.com
Logo TI1 - Texas Instruments

SN74LVC1G34DBVT Datasheet(HTML) 6 Page - Texas Instruments

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SN74LVC1G34
SCES519M – DECEMBER 2003 – REVISED APRIL 2016
www.ti.com
Product Folder Links: SN74LVC1G34
Submit Documentation Feedback
Copyright © 2003–2016, Texas Instruments Incorporated
(1)
All unused inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application report,
Implications of Slow or Floating CMOS Inputs, literature number SCBA004.
7.3 Recommended Operating Conditions
(1)
MIN
MAX
UNIT
VCC
Supply voltage
Operating
1.65
5.5
V
Data retention only
1.5
VIH
High-level input voltage
VCC = 1.65 V to 1.95 V
0.65 × VCC
V
VCC = 2.3 V to 2.7 V
1.7
VCC = 3 V to 3.6 V
2
VCC = 4.5 V to 5.5 V
0.7 × VCC
VIL
Low-level input voltage
VCC = 1.65 V to 1.95 V
0.35 × VCC
V
VCC = 2.3 V to 2.7 V
0.7
VCC = 3 V to 3.6 V
0.8
VCC = 4.5 V to 5.5 V
0.3 × VCC
VI
Input voltage
0
5.5
V
VO
Output voltage
0
VCC
V
IOH
High-level output current
VCC = 1.65 V
–4
mA
VCC = 2.3 V
–8
VCC = 3 V
–16
–24
VCC = 4.5 V
–32
IOL
Low-level output current
VCC = 1.65 V
4
mA
VCC = 2.3 V
8
VCC = 3 V
16
24
VCC = 4.5 V
32
Δt/Δv
Input transition rise or fall rate
VCC = 1.8 V ± 0.15 V, 2.5 V ± 0.2 V
20
ns/V
VCC = 3.3 V ± 0.3 V
10
VCC = 5 V ± 0.5 V
10
TA
Operating free-air temperature
DSBGA package
–40
85
°C
All other packages
-40
125
°C
(1)
For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
7.4 Thermal Information
THERMAL METRIC(1)
SN74LVC1G34
UNIT
DBV
DCK
DRL
DRY
YZP
DPW
5 PINS
5 PINS
5 PINS
6 PINS
5 PINS
4 PINS
RθJA
Junction-to-ambient thermal resistance
229
278
243
439
130
340
°C/W
RθJC(top)
Junction-to-case (top) thermal resistance
164
93
78
277
54
215
RθJB
Junction-to-board thermal resistance
62
65
78
271
51
294
ψJT
Junction-to-top characterization parameter
44
2
10
84
1
41
ψJB
Junction-to-board characterization parameter
62
64
77
271
50
294
RθJC(bot)
Junction-to-case (bottom) thermal resistance
–
–
–
–
–
250



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