THS789PFD datasheet(7/34 Pages) TI1

7 / 34 page

Sync to Event Delay (ns)

THS789

www.ti.com

SLOS776A – SEPTEMBER 2012 – REVISED DECEMBER 2015

6.6 Host Serial Interface DC Characteristics

over operating junction temperature range (unless otherwise noted)

PARAMETER

TEST CONDITIONS

MIN

TYP

MAX

UNIT

VIH

High-level input voltage

0.7 × VCC

VCC + 0.5

VIL

Low-level input voltage

GND – 0.3

0.3 × VCC

VOH

High-level output voltage

VCC – 0.5

VCC + 0.3

VOL

Low-level output voltage

0.4

Ilkg

Leakage current

µA

6.7 Host Serial Interface AC Characteristics

over operating junction temperature range (unless otherwise noted)

PARAMETER

TEST CONDITIONS

MIN

TYP

MAX

UNIT

HCLK frequency

MHz

Rise and fall times

3.5

HCLK duty cycle

40%

50%

60%

Hstrobe high period between two consecutive transactions

Hstrobe low to HCLK high setup

HCLK high to Hstrobe high hold time

Hdata in to HCLK high setup

Hdata in to HCLK high hold time

HCLK falling edge to Hdata out (L or H)

CL = 20 pF

3.25

HCLK falling edge to Hdata out (H or L)

CL = 20 pF

3.25

6.8 Power Consumption

Typical conditions are at 55°C junction temperature, VCC = 3.3 V.

CONDITION

TYP

MAX

UNIT

Four channel current

925

1236

6.9 Typical Characteristics

Figure 1. Typical Per Channel Sigmas vs 5-ns (200-MHz) Window

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