15

15

15

notEs

Measurements

The luminous flux, radiant power, chromaticity and CRI measurements in this document are binning specifications only and solely

represent product measurements as of the date of shipment. These measurements will change over time based on a number of factors

that are not within Cree’s control and are not intended or provided as operational specifications for the products. Calculated values are

provided for informational purposes only and are not intended as specifications.

Pre‑Release Qualification Testing

Please read the LeD Reliability Overview for details of the qualification process Cree applies to ensure long-term reliability for XLamp

LEDs and details of Cree’s pre-release qualification testing for XLamp LEDs.

Lumen Maintenance

Cree now uses standardized IES LM-80-08 and TM-21-11 methods for collecting long-term data and extrapolating LED lumen maintenance.

For information on the specific LM-80 data sets available for this LED, refer to the public LM-80 results document.

Please read the Long-Term Lumen Maintenance application note for more details on Cree’s lumen maintenance testing and forecasting.

Please read the Thermal Management application note for details on how thermal design, ambient temperature, and drive current affect

the LeD junction temperature.

Moisture sensitivity

Cree recommends keeping XLamp ML-C LEDs in the provided, resealable moisture-barrier packaging (MBP) until immediately prior to

soldering. Unopened MBPs that contain XLamp LEDs do not need special storage for moisture sensitivity.

Once the MBP is opened, XLamp ML-C LEDs should be handled and

stored as MSL 2a per JeDeC J-STD-033, meaning they have limited

exposure time before damage to the LeD may occur during the soldering

operation. The table on the right specifies the maximum exposure time

in days depending on temperature and humidity conditions. LeDs with

exposure time longer than the specified maximums must be baked

according to the baking conditions listed below.

baking Conditions

It is not necessary to bake all XLamp ML-C LEDs. Only the LEDs that meet all of the following criteria must be baked:

1. LEDs that have been removed from the original MBP.

2. LeDs that have been exposed to a humid environment longer than listed in the Moisture Sensitivity section above.

3. LeDs that have not been soldered.

temp.

Maximum Percent relative humidity

30%

40%

50%

60%

70%

80%

90%

35 ºC

-

-

-

17

1

.5

.5

30 ºC

-

-

-

28

1

1

1

25 ºC

-

-

-

-

2

1

1

20 ºC

-

-

-

-

2

1

1