ML-C datasheet(1/19 Pages) CREE

Part #	ML-C

Description	XLamp LEDs

PDF	19 Pages

Scroll/Zoom	100%

Manufacturer	CREE [Cree, Inc]

Direct Link	http://www.cree.com/

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1 / 19 page

11

Product family data sheet

registered trademarks and the Cree logo is a trademark of Cree, Inc. UL® and the UR logo are registered trademarks of UL LLC.

Cree, Inc.

4600 Silicon Drive

Durham, NC 27703

USA Tel: +1.919.313.5300

Cree® XLamp® ML-C LEDs

ProDuCt DEsCriPtion

The Cree XLamp® ML-C LeD brings

lighting-classreliabilityandperformance

to 1/3-watt LeDs. The XLamp ML-C LeD

expands Cree’s lighting-class leadership

to LeD bulbs and linear and distributed

lighting applications. With XLamp

LeD lighting-class reliability, a wide

viewing angle, uniform light output, and

industry-leading chromaticity binning in

a 3.5-mm X 3.5-mm package, the XLamp

ML-C LeD continues Cree’s history of

segment-focused product innovation in

LeDs for lighting applications.

The XLamp ML-C LeD brings high

performance and a smooth look to a

wide range of lighting applications,

including linear lighting, fluorescent

retrofits and retail-display lighting.

FEAturEs

• Available in white (2600 K to 8300 K

CCT), 80-, 85- and 90-CRI minimum

and royal blue

• White LeDs available in both parallel

and series

• ANSI-compatible sub-bins

• Maximum drive current: 350 mA for

parallel, 175 mA for series, 250 mA

for royal blue

• 120° viewing angle, uniform

chromaticity profile

• electrically neutral thermal path

• RoHS and ReACh compliant

• UL® recognized component

(E349212)

tAbLE oF ContEnts

Characteristics ............................................2

Flux Characteristics ....................................3

Relative Spectral Power Distribution .........6

Relative Luminous Flux vs. Junction

Temperature ................................................7

Relative Radiant Flux vs. Junction

Temperature ................................................7

electrical Characteristics............................8

Relative Luminous Flux vs. Current............9

Relative Radiant Flux vs. Current ............ 10

Typical Spatial Distribution...................... 11

Thermal Design........................................ 12

Reflow Soldering Characteristics............ 14

Notes ........................................................ 15

Mechanical Dimensions .......................... 17

Tape and Reel........................................... 18

Packaging................................................. 19

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