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CLT3-4BT6 Datasheet(PDF) 8 Page - STMicroelectronics |
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CLT3-4BT6 Datasheet(HTML) 8 Page - STMicroelectronics |
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8 / 10 page ![]() CLT3-4BT6 8/10 COM IN ESD12 IN2 VC OUT1 OUT2 OUT4 OUT3 COM34 COM COM COM12 COM COM 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 COM ESD34 IN3 IN4 ESDC PIN-OUT CONNECTION The pins ESD, COMIJ, COM (pins # 1, 3, 6, 8, 10, 11, 13, 15, 16, 18, 20) must be connected together externally. This common pad COM is enlarged to reduce the thermal resistance and improve the device cooling. The COM and IN pins are designed to minimize the EMI effects on the circuit. 0 20 40 60 80 100 120 140 160 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 S(cm²) R °C/W) th(j-a)( Fig. 9: Typical junction to ambient thermal resis- tance versus copper surface under common pad (FR4 epoxy; copper thickness is 35µm). |
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