PS7200R-1A

RECOMMENDED SOLDERING CONDITIONS

(1) Infrared reflow soldering

• Peak reflow temperature

235 °C or below (package surface temperature)

•Time of temperature higher than 210 °C

30 seconds or less

• Number of reflows

Two

• Flux

Rosin flux containing small amount of chlorine

(The flux with a maximum chlorine content of 0.2 Wt % is recommended.)

Recommended Temperature Profile of Infrared Reflow

(2) Dip soldering

•Temperature

260 °C or below (molten solder temperature)

•Time

10 seconds or less

• Preheating conditions

100°C or below (package surface temperature)

• Number of times

One

• Flux

Rosin flux containing small amount of chlorine

(The flux with a maximum chlorine content of 0.2 Wt % is recommended.)

(3) Cautions

• Fluxes

Avoid removing the residual flux with freon-based and chlorine-based cleaning solvent.

Time (s)

100 to 160 ûC

60 to 120 s

(preheating)

(heating)

to 10 s

to 30 s

235 ûC (peak temperature)

210 ûC

A Business Partner of NEC Compound Semiconductor Devices, Ltd.

11/11/2002

Life Support Applications

These NEC products are not intended for use in life support devices, appliances, or systems where the malfunction of these products can reasonably be expected

to result in personal injury. The customers of CEL using or selling these products for use in such applications do so at their own risk and agree to fully indemnify

CEL for all damages resulting from such improper use or sale.