IC-MB4_15 datasheet(4/40 Pages) ICHAUS

4 / 40 page

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iC-MB4

BiSS INTERFACE MASTER

Rev B2, Page 4/40

PIN CONFIGURATION QFN28 5 mm x 5 mm

(topview)

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iC−MB4

PIN FUNCTIONS

No. Name

Function

SPI Communication Mode

(CFGSPI = 1)

27 NCS

SPI Chip Select Input, active low

28 ALE

SPI Clock Input

1 DB0

SPI Serial Data Input

2 DB1

SPI Serial Data Output

5 DB4

SPI2 Chip Select Input, active low

6 DB5

SPI2 Clock Input

7 DB6

SPI2 Serial Data Input

8 DB7

SPI2 Serial Data Output

Data Bus Communication Mode

(CFGSPI = 0)

1 DB0

Data Bus Input/Output

2 DB1

Data Bus Input/Output

3 DB2

Data Bus Input/Output

4 DB3

Data Bus Input/Output

5 DB4

Data Bus Input/Output

6 DB5

Data Bus Input/Output

7 DB6

Data Bus Input/Output

8 DB7

Data Bus Input/Output

9 GND

Ground

10 VDD

+3 V . . . +5.5 V Supply Voltage

11 EOT

End of transmission Output

12 GETSENS

Sensor Data Request Input

13 NER

Error Message Input/Output,

low active

14 n.c.

not connected

15 MA1

BiSS Clock Line Output

16 MA2_NMA1 BiSS Clock Line Output Channel

17 SL1

BiSS Data Line Input

18 SL2_NSL1

BiSS Data Line Input Channel 2

19 INT_NMOT Communication Mode Select In-

put

(Intel = 1, Motorola = 0)

20 CFGSPI

Serial/Parallel Mode Select Input

(serial SPI = 1, parallel = 0)

21 NRES

Reset Input, low active

22 CLK

External Clock Input

23 MO1

BiSS Data Line Output

24 MO2_NMO1 BiSS Data Line Output Channel 2

25 NWR_E

Write Input, active low (Intel)

Enable Input, active high (Mo-

torola)

26 NRD_RNW Read Input, active low (Intel)

Read/Not-Write Select Input

(Motorola)

27 NCS

Chip Select Input, active low

28 ALE

Address Latch Enable Input

Thermal Pad (GND)

The Thermal Pad must be connected to GND.

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