LT3498

23

3498f

Information furnished by Linear Technology Corporation is believed to be accurate and reliable.

However, no responsibility is assumed for its use. Linear Technology Corporation makes no representa-

tion that the interconnection of its circuits as described herein will not infringe on existing patent rights.

PACKAGE DESCRIPTION

DDB Package

12-Lead Plastic DFN (3mm × 2mm)

(Reference LTC DWG # 05-08-1723 Rev Ø)

2.00

±0.10

(2 SIDES)

NOTE:

1. DRAWING IS NOT A JEDEC PACKAGE OUTLINE

2. DRAWING NOT TO SCALE

3. ALL DIMENSIONS ARE IN MILLIMETERS

4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE

MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE

5. EXPOSED PAD SHALL BE SOLDER PLATED

6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION ON THE TOP AND BOTTOM OF PACKAGE

0.40

± 0.10

BOTTOM VIEW—EXPOSED PAD

0.64

± 0.10

(2 SIDES)

0.75

±0.05

R = 0.115

TYP

R = 0.05

TYP

2.39

±0.10

(2 SIDES)

3.00

±0.10

(2 SIDES)

1

6

12

7

PIN 1 BAR

TOP MARK

(SEE NOTE 6)

0.200 REF

0 – 0.05

(DDB12) DFN 0106 REV Ø

0.23

± 0.05

0.45 BSC

PIN 1

R = 0.20 OR

0.25

× 45°

CHAMFER

0.25

± 0.05

2.39

±0.05

(2 SIDES)

RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS

APPLY SOLDER MASK TO AREAS THAT ARE NOT SOLDERED

0.64

±0.05

(2 SIDES)

1.15

±0.05

0.70

±0.05

2.55

±0.05

PACKAGE

OUTLINE

0.45 BSC