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IXD1701 Datasheet(PDF) 27 Page - Zilog, Inc. |
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IXD1701 Datasheet(HTML) 27 Page - Zilog, Inc. |
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27 / 33 page ![]() Product Specification IXD1701 PS034001-0515 PRELIMINARY 27 PACKAGE POWER DISSIPATION (CONTINUED) SOT-89-5 Power Dissipation The power dissipation varies with the mount board conditions. Please use this data as a reference only. 1. Measurement Conditions: Condition: Mount on a board Ambient: Natural convection Soldering: Lead (Pb) free Board: Dimensions 40×40 mm (1600 mm 2 in one side) Copper (Cu) traces occupy 50% of the board area on top and bottom layers Package heat sink tied to the copper traces. Material: Glass Epoxy (FR-4) Thickness: 1.6 mm Through-hole: 5 x 0.8 Diameter 2. Power Dissipation vs. Ambient Temperature Board Mount (Tjmax = 125 0C) Ambient Temperature, 0C Power Dissipation Pd, mW Thermal Resistance, 0C/W 25 1300 76.92 85 500 |
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