LMX9820ASM datasheet(7/44 Pages) NSC

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Revision 1.0

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5.0 Pad Descriptions (Continued)

Treat as no connect. Pad required for mechanical stability.

Table 8. Power, Ground, and No Connect Signals

Pad Name

Pad

Location

Direction

Description

A1, A2, A3, A4, A5,

A6, A7, A9, B1, C1,

D1, D13, E1, E13,

F1, G1, G7, H1, H4,

J1, J3, J6, J7, J9,

J10, J11

No Connect

No Connect. Pad required for mechanical stability.

RF GND 1

B2, B3, B4, B5, B6,

B7, C2, C3, C4, C5,

C6, C7, D2, D3, D4,

D5, D6, D7, E2, E3,

E4, E5, E6, E7, F2,

F3, F4, F5, F6, F7,

G2, G3, G4, G5,

G6, H5, H6, H7, H9,

H10, H11

Input

Radio System Ground. Must be connected to RF

Ground plane. Thermal relief required for proper solder-

ing.

Dig_gnd_1 1

D12

Input

Digital Ground

Dig_gnd_2 1

G11

Input

Digital Ground

VCC

Input

2.85V to 3.6V Input for Internal Power Supply Regula-

tors

VDD_ANA_OUT

Output

Voltage Regulator Output/Power Supply for Analog

Circuitry. If not used, place pad and do not connect to

VCC or Ground.

VDD_DIG_OUT

Output

Voltage Regulator Output/Power Supply for Digital

Circuitry. If not used, place pad and do not connect to

VCC or Ground.

VDD_DIG_PWR_D#

Input

Power Down for the Internal Power Supply Regulator

for the Digital Circuitry. Place pad and do not connect to

VCC or Ground.

Connect RF GND, Dig_gnd_1, and Dig_gnd_2 to a single ground plane.

LMX9820ASM Datasheet(PDF) 7 Page - National Semiconductor (TI)

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