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STM32WB55CCU6TR Datasheet(PDF) 85 Page - STMicroelectronics

Part # STM32WB55CCU6TR
Description  Multiprotocol wireless 32-bit MCU Arm®-based Cortex®-M4 with FPU, Bluetooth® 5 and 802.15.4 radio solution
PDF  193 Pages
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Manufacturer  STMICROELECTRONICS [STMicroelectronics]
Direct Link  http://www.st.com
Logo STMICROELECTRONICS - STMicroelectronics

STM32WB55CCU6TR Datasheet(HTML) 85 Page - STMicroelectronics

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DS11929 Rev 10
85/193
STM32WB55xx STM32WB35xx
Electrical characteristics
169
Table 20. Voltage characteristics(1)
Symbol
Ratings
Min
Max
Unit
VDDX - VSS
External main supply voltage
(including VDD, VDDA, VDDUSB, VLCD, VDDRF,
VDDSMPS, VBAT, VREF+)
-0.3
4.0
V
VIN(2)
Input voltage on FT_xxx pins
VSS-0.3
min (VDD, VDDA, VDDUSB, VLCD,
VDDRF, VDDSMPS) + 4.0(3)(4)
Input voltage on TT_xx pins
4.0
Input voltage on any other pin
4.0
|∆VDDx|
Variations between different VDDX power pins
of the same domain
-50
mV
|VSSx-VSS|
Variations between all the different ground
pins(5)
-50
VREF+ - VDDA Allowed voltage difference for VREF+ > VDDA
-0.4
V
1. All main power (VDD, VDDRF, VDDA, VDDUSB, VLCD, VBAT) and ground (VSS, VSSA) pins must always be connected to the
external power supply, in the permitted range.
2. VIN maximum must always be respected. Refer to Table 21 for the maximum allowed injected current values.
3. This formula has to be applied only on the power supplies related to the IO structure described in the pin definition table.
4. To sustain a voltage higher than 4 V the internal pull-up/pull-down resistors must be disabled.
5. Include VREF- pin.
Table 21. Current characteristics
Symbol
Ratings
Max
Unit
∑IVDD
Total current into sum of all VDD power lines (source)(1)
130
mA
∑IVSS
Total current out of sum of all VSS ground lines (sink)(1)
130
IVDD(PIN)
Maximum current into each VDD power pin (source)(1)
100
IVSS(PIN)
Maximum current out of each VSS ground pin (sink)(1)
100
IIO(PIN)
Output current sunk by any I/O and control pin except FT_f
20
Output current sunk by any FT_f pin
20
Output current sourced by any I/O and control pin
20
∑IIO(PIN)
Total output current sunk by sum of all I/Os and control pins(2)
100
Total output current sourced by sum of all I/Os and control pins(2)
100
IINJ(PIN)(3)
Injected current on FT_xxx, TT_xx, RST and B pins, except PB0 and PB1
–5 / +0(4)
Injected current on PB0 and PB1
-5/0
∑|IINJ(PIN)|
Total injected current (sum of all I/Os and control pins)(5)
25
1. All main power (VDD, VDDRF, VDDA, VDDUSB, VBAT) and ground (VSS, VSSA) pins must always be connected to the external
power supplies, in the permitted range.
2. This current consumption must be correctly distributed over all I/Os and control pins. The total output current must not be
sunk/sourced between two consecutive power supply pins referring to high pin count packages.
3. Positive injection (when VIN > VDD) is not possible on these I/Os and does not occur for input voltages lower than the
specified maximum value.
4. A negative injection is induced by VIN < VSS. IINJ(PIN) must never be exceeded. Refer also to Table 20: Voltage
characteristics for the maximum allowed input voltage values.



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