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AF126 Datasheet(PDF) 13 Page - 3M Electronics

Part # AF126
Description  Scotch-WeldTM Structural Adhesive Film
PDF  15 Pages
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Manufacturer  3M [3M Electronics]
Direct Link  http://www.3m.com
Logo 3M - 3M Electronics

AF126 Datasheet(HTML) 13 Page - 3M Electronics

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Scotch-WeldTM
Structural Adhesive Film
AF 126 • AF 126 FR
Product Application
(continued)
Primer Application
Priming of bonding surfaces offers two distinct advantages: (1) Priming insures complete
wetting of metal surfaces which normally results in superior environmental and low
temperature properties and (2) Priming simplifies production by protecting cleaned parts
until bonding can be completed. The following system is suggested for spray application.
See separate Product Specification Sheet for 3M™ Scotch-Weld™ Structural Adhesive
Primer EC-2320 before using.
Spray Gun
DeVilbiss JGA
Air Cap
Number 78
Nozzle
AV-15-FX
Needle
FX
Line Pressure
35 psi
2.4 bar
Cup Pressure
1-2 psi
69-138 millibar
Distance from Panel
9 ± 3 inches
23 ± 7.6 cm
Primer Thickness (dry)
0.00005-0.0002 inches
1.3-5.1 micron
If part design permits, parts may be primed by dipping and draining.
Dry Cycle
The following dry cycle for Scotch-Weld EC-2320 is suggested for use with 3M™
Scotch-Weld™ Structural Adhesive Films AF 126.
Air Dry:
Air dry at 75-85°F (24-29.4°C) for a minimum of 30 minutes.
Plus Force Dry:
Circulating air oven with part at 200°F (93.3°C) for 30 minutes.
OR
Alternate Dry:
Air dry at 75-85°F (24-29°C) for a minimum of 2 hours.
Cure Cycle
General Cure Requirements
Time, temperature and pressure determine the final bond properties. These properties
may also be affected by the type of curing equipment used for each specific application.
Curing ovens must be vented to the outdoors. In general, the cure properties of Scotch-
Weld AF 126 are as follows:
Cure Pressure
Pressure is required during cure to keep parts in alignment and to overcome distortion
and thermal expansion in the adherends. When bonding honeycomb sandwiches
utilizing non-perforated core, pressure is required to overcome the thermal expansion of
the air contained in each cell of the honeycomb. Honeycomb sections have been bonded
successfully with Scotch-Weld AF 126 using perforated or non-perforated core under
pressure of 10-25 psi (68.9-172.3 kPa).
Cure Temperature
The cure temperature may be varied from 180 to 350°F (82-177°C) depending upon the
materials being bonded, equipment available and bond properties desired. The film will
soften as temperatures are increased and will wet the surface and fillet the core to which
it has been applied. A chemical cure will be initiated at 180°F (82°C) and a low strength
gel formed. Continued heating chemically converts this gel into a high strength, solvent
resistant bond. Cure temperatures in excess of 350°F (177°C) yield usefully, but lower
than optimum strengths.
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