Electronic Components Datasheet Search
  English  ▼
ALLDATASHEET.NET

X  

AF126 Datasheet(PDF) 14 Page - 3M Electronics

Part # AF126
Description  Scotch-WeldTM Structural Adhesive Film
PDF  15 Pages
Scroll/Zoom Zoom In 100%  Zoom Out
Manufacturer  3M [3M Electronics]
Direct Link  http://www.3m.com
Logo 3M - 3M Electronics

AF126 Datasheet(HTML) 14 Page - 3M Electronics

Back Button AF126 Datasheet HTML 7Page - 3M Electronics AF126 Datasheet HTML 8Page - 3M Electronics AF126 Datasheet HTML 9Page - 3M Electronics AF126 Datasheet HTML 10Page - 3M Electronics AF126 Datasheet HTML 11Page - 3M Electronics AF126 Datasheet HTML 12Page - 3M Electronics AF126 Datasheet HTML 13Page - 3M Electronics AF126 Datasheet HTML 14Page - 3M Electronics AF126 Datasheet HTML 15Page - 3M Electronics  
Zoom Inzoom in Zoom Outzoom out
 14 / 15 page
background image
3M™ Scotch-Weld™ Structural Adhesive Film AF 126 and AF 126 FR must be stored
at 0°F (-18°C) or lower. Allow these products to return to room temperature before using
to prevent moisture condensation on the adhesive surface or cracking during handling.
Refrigerated storage at 40°F ± 5°F (4°C ± 3°C) is suggested for 3M™ Scotch-Weld™
Structural Adhesive Primer EC-2320. Primer should be permitted to thoroughly warm to
room temperature before using in order to prevent moisture condensation.
Storage
The shelf life of Scotch-Weld AF 126 and AF 126 FR is 3 months at 0°F (-18°C) or
below.
The out times* is:
1. at 40°F (4°C) – 30 days
2. at 75°F (24°C) – 10 days
3. at 90°F (32°C) – 5 days
*as measured by peel test values.
Shelf Life
Scotch-WeldTM
Structural Adhesive Film
AF 126 • AF 126 FR
Product Application
(continued)
Cure Time
Cure time depends on the cure temperature used, methods of heat application,
production limitations and bond properties required. Since no two bonding operations
are exactly alike, it is suggested that a few simple experiments be conducted varying
both temperature and cure time to determine optimum conditions for the particular
application.
The following cure cycle is suggested to obtain dense glue lines and was used to obtain
the strengths reported in the Test Results section:
1. Apply a pressure of 50 psi (0.35 MPa) prior to reaching a bond line temperature of
150°F (66°C) and maintain throughout the cure cycle.
2. Raise the bond line temperature from ambient to 250°F (121°C).
3. Cure for 60 minutes at 250°F (121°C).
4. Cool to below 200°F (93°C) bond line temperature prior release of pressure.
- 14 -



Html Pages

1 2 3 4 5 6 7 8 9 10 11 12 13 14 15


Datasheet Download

Go To PDF Page


Link URL



Does ALLDATASHEET help your business so far?  [ DONATE ] 

About Alldatasheet   |   Advertisement   |   Contact us   |   Privacy Policy   |   Link to Datasheet    |   Link Exchange   |   Manufacturer List
All Rights Reserved©Alldatasheet.com


Mirror Sites
English : Alldatasheet.com  |   English : Alldatasheet.net  |   Chinese : Alldatasheetcn.com  |   German : Alldatasheetde.com  |   Japanese : Alldatasheet.jp
Russian : Alldatasheetru.com  |   Korean : Alldatasheet.co.kr  |   Spanish : Alldatasheet.es  |   French : Alldatasheet.fr  |   Italian : Alldatasheetit.com
Portuguese : Alldatasheetpt.com  |   Polish : Alldatasheet.pl  |   Vietnamese : Alldatasheet.vn
Indian : Alldatasheet.in  |   Mexican : Alldatasheet.com.mx  |   British : Alldatasheet.co.uk  |   New Zealand : Alldatasheet.co.nz
Family Site : ic2ic.com  |   icmetro.com