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AM6421 Datasheet(PDF) 119 Page - Texas Instruments |
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AM6421 Datasheet(HTML) 119 Page - Texas Instruments |
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119 / 237 page ![]() 7.9 Thermal Resistance Characteristics This section provides the thermal resistance characteristics used on this device. For reliability and operability concerns, the maximum junction temperature of the device has to be at or below the TJ value identified in Section 7.4, Recommended Operating Conditions. 7.9.1 Thermal Resistance Characteristics for ALV Package It is recommended to perform thermal simulations at the system level with the worst case device power consumption. NO. PARAMETER DESCRIPTION ALV PACKAGE °C/W(1) (3) AIR FLOW (m/s)(2) T1 RΘJC Junction-to-case 0.98 N/A T2 RΘJB Junction-to-board 3.87 N/A T3 RΘJA Junction-to-free air 12.8 0 T4 Junction-to-moving air TBD 1 T5 TBD 2 T6 TBD 3 T7 ΨJT Junction-to-package top 0.53 0 T8 TBD 1 T9 TBD 2 T10 TBD 3 T11 ΨJB Junction-to-board 3.74 0 T12 TBD 1 T13 TBD 2 T14 TBD 3 (1) These values are based on a JEDEC defined 2S2P system (with the exception of the Theta JC [RΘJC] value, which is based on a JEDEC defined 1S0P system) and will change based on environment as well as application. For more information, see these EIA/ JEDEC standards: • JESD51-2, Integrated Circuits Thermal Test Method Environment Conditions - Natural Convection (Still Air) • JESD51-3, Low Effective Thermal Conductivity Test Board for Leaded Surface Mount Packages • JESD51-6, Integrated Circuit Thermal Test Method Environmental Conditions - Forced Convection (Moving Air) • JESD51-7, High Effective Thermal Conductivity Test Board for Leaded Surface Mount Packages • JESD51-9, Test Boards for Area Array Surface Mount Packages (2) m/s = meters per second. (3) °C/W = degrees Celsius per watt. www.ti.com AM6442, AM6441, AM6421 AM6412, AM6411 SPRSP56 – JANUARY 2021 Copyright © 2021 Texas Instruments Incorporated Submit Document Feedback 119 Product Folder Links: AM6442 AM6441 AM6421 AM6412 AM6411 |
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