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MCP3462 Datasheet(PDF) 79 Page - Microchip Technology |
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MCP3462 Datasheet(HTML) 79 Page - Microchip Technology |
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79 / 108 page  2019-2021 Microchip Technology Inc. DS20006180D-page 79 MCP3461/2/4 Figure 7-6 shows an example of a power supply schematic with separate DVDD and AVDD. A high-current LDO (MCP1825) was used for the DVDD line in order to be able to power the MCU and other peripherals attached to the MCU. A high PSRR LDO is used (MCP1754) for the AVDD that goes to the ADC and a few other components sensitive to noise. The NET tie is used to separate DGND from AGND. FIGURE 7-5: Separating Digital and Analog Ground by Using a Star Connection. FIGURE 7-6: Power Supply with Separate Lines for Analog and Digital Sections. Note the “Net Tie” Object that Represents the Star Ground Connection. FIGURE 7-7: Separation of Analog and Digital Circuits on Layout. When remote sensors are used to reduce sensitivity to external influences, such as EMI, the wires that connect the sensor to the ADC should form a twisted pair. Ferrite beads can be used between the digital and analog ground planes to keep high-frequency noise from entering the device. The ferrite bead is recommended to be low resistance. VA VD MCU “Star” Point IA ID ID IA AVDD DVDD AGND DGND D-= A-= 0.1 μF MCP346x 0.1 μF C GND GND GND GND +5V USB GNDA +9V IN Power Jack 2.5mm 2 3 1 J10 MRA4005 D1 9V 0.1 F 0603 C11 0.1 F 0603 C10 GND 3.3A 3.3D GNDA GNDA 0.1 F 0603 C12 MCP1754-3.3V VOUT 3 VIN 1 U3 GND LM1117-5V VIN 3 VOUT 2 U4 MCP1825S-3.3V VOUT 3 VIN 1 U2 5V GND Net Tie GND GNDA 10uF TANT-B C15 10 F TANT-B C44 10 F TANT-B C13 10 F TANT-B C45 GND J9 5V_USB 0.1 F 0603 C14 GNDA 1 17 2 3 4 5 67 8 9 10 15 14 13 12 11 20 19 18 16 CH0 CH1 SCK CS SDO EP 21 REFIN- CH2 REFIN+ SDI IRQ/MDAT ANALOG DIGITAL |
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