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IMX6SDLCEC Datasheet(PDF) 139 Page - NXP Semiconductors |
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IMX6SDLCEC Datasheet(HTML) 139 Page - NXP Semiconductors |
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139 / 169 page  Package Information and Contact Assignments i.MX 6Solo/6DualLite Applications Processors for Consumer Products, Rev. 9, 11/2018 NXP Semiconductors 139 Table 95 shows the 21 × 21 mm BGA package details. Table 95. 21 x 21, 0.8 mm BGA Package Details Parameter Symbol Common Dimensions Minimum Normal Maximum Total Thickness A — — 1.6 Stand Off A1 0.36 — 0.46 Substrate Thickness A2 0.26 REF Mold Thickness A3 0.7 REF Body Size D 21 BSC E 21 BSC Ball Diameter — 0.5 Ball Opening — 0.4 Ball Width b 0.44 — 0.64 Ball Pitch e 0.8 BSC Ball Count n 624 Edge Ball Center to Center D1 19.2 BSC E1 19.2 BSC Body Center to Contact Ball SD — SE — Package Edge Tolerance aaa 0.1 Mold Flatness bbb 0.2 Coplanarity ddd 0.15 Ball Offset (Package) eee 0.15 Ball Offset (Ball) fff 0.08 |
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