VPA2000 datasheet(3/25 Pages) RENESAS

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VPA2000

Product Data

March 11, 2010

ABSOLUTE MAXIMUM RATINGS

Table 1. Absolute Maximum Ratings Summary

MAXIMUM RATING [NOTE 1]

Input Voltage, VIN1, VIN2 to

GND

-0.3V to 6V

SWN, INP1, INN1, OUT1,

VGLREG, AVDD to GND

-0.3V to +24V

ON to GND

-0.3V to +27V

All other pins to GND

-0.3V to VIN+0.3V

Operating Ambient

Temperature Range

-40°C to +85°C

Storage Temperature

-55°C to +150°C

Junction Temperature

-40°C to +125°C

Lead Temperature

(10 seconds)

+260°C

Maximum Power Dissipation

Internally limited [Note 2]

Table 2. Package Thermal Resistivity

PACKAGE

THERMAL RESISTIVITY (ΘJA) [NOTE 3]

QFN-24

4mm x 4mm

43.2 °C/W

[Note 3] This thermal rating was calculated based on JEDEC standard

conditions (EIA-JESD 51-2 for natural convection & JESD 51-6 for

forced convection). The board type is 2S2P recommended by JEDEC

(4-layers: 2 oz copper surface traces/ 1 oz copper buried planes,

4" x 4.5" board size). Actual thermal resistivity will be affected by PCB

size, solder joint quality, PCB layer count, copper thickness, air flow,

altitude, and other unlisted variables.

[Note 1] Stresses greater than those listed under Absolute Maximum

Ratings may cause permanent damage to the device. This is a stress

rating only and functional operation of the device at these or any other

conditions above those indicated in the operational sections of this

specification is not implied. Exposure to absolute maximum rating

conditions for extended periods may affect reliability.

[Note 2] The maximum power dissipation is PD(MAX) = (TJ(MAX)-TA)

/θJA where TJ(MAX) is 125°C. Exceeding the maximum allowable power

dissipation will result in excessive die temperature, and the device will

enter thermal shutdown.

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